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China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling
9+ hour, 18+ min ago (118+ words) digitimes China GPU developer Biren expands AI chip R&D into optical interconnects, advanced cooling Keep me signed in - Track financials & stock data of Taiwan tech. - Tungsten prices surge sixfold as US-China restrictions tighten supply for chips, aerospace, defense - OCP…...
Malaysia considers using Huawei chips for national AI project
2+ hour, 21+ min ago (157+ words) Malaysia is considering using AI chips from Chinese manufacturer Huawei to power its national AI initiative, marking the first known instance of a foreign government opting for Chinese accelerators over American technology, Bloomberg reports. The government is evaluating Huawei's Ascend…...
Malaysia considers using Huawei chips for USD 494 million national AI project
3+ hour, 38+ min ago (160+ words) Malaysia is considering using AI chips from Chinese manufacturer Huawei to power its national AI initiative, marking the first known instance of a foreign government opting for Chinese accelerators over American technology, Bloomberg reports. The government is evaluating Huawei's Ascend…...
High-end chip from Huawei released
4+ hour, 49+ min ago (416+ words) The chip, which powers Huawei's newly released Mate XT 2 tri-fold smartphone, is the industry's first high-performance processor to adopt the company's LogicFolding technology. View all posts by Ma Si → BEIJING – Huawei Technologies Co on Monday unveiled its latest flagship chip,…...
ASML to partner with major chipmakers for next-generation tools for larger data center chips
11+ hour, 15+ min ago (389+ words) ANI 08 Sep 2026, 22:28 GMT+ New Delhi [India], September 8 (ANI): Dutch semiconductor equipment manufacturer ASML plans to collaborate with its major customers to deploy its most advanced tools for producing large data center chips designed by firms such as Nvidia, according to…...
TSMC and Samsung plan to introduce ASML high-NA EUV systems
6+ hour, 53+ min ago (167+ words) TSMC and Samsung plan to introduce new ASML EUV systems UA.NEWS TSMC and Samsung plan to introduce new ASML EUV systems In Taiwan, the Taipei Times reports that TSMC plans to use ASML high-numerical-aperture systems for mass chip production…...
TSMC and Samsung Commit to ASML High-NA EUV Machines for AI Chip Production: 11 outlets compared
8+ hour, 46+ min ago (456+ words) TSMC will deploy High-NA EUV machines starting 2030 Samsung aims adoption by 2030, with 12-inch mask transition by 2033 9 of 11 outlets skipped it: intel already processed over a million wafers using High-NA. Samsung and TSMC have committed to using ASML’s High-NA EUV lithography…...
ASML to work with major chipmakers to use latest tools for larger chips
1+ day, 37+ min ago (374+ words) SAN FRANCISCO, Sept 7 (Reuters) – ASML, the Dutch chip manufacturing tool company, said it plans to work together with its major customers to produce its most advanced tools for developing the kind of large data center chips designed by Nvidia and…...
Top chipmakers embrace ASML’s $400M machines, agree to crucial chipmaking change
14+ hour, 30+ min ago (186+ words) Chipmaking changes could boost productivity of new ASML machines by 40 percent. Leading chipmakers Samsung Electronics and Taiwan Semiconductor Manufacturing Co. announced plans to adopt ASML’s latest chipmaking machines in the next several years—and they also joined Intel in agreeing…...
TSMC, Samsung Back High NA EUV And New Mask Size
10+ hour, 29+ min ago (867+ words) After dismissing high NA EUV lithography, Samsung and TSMC have separately endorsed the technology. Besides Samsung and TSMC, Intel continues to push for the development of a new 6- x 12-inch mask format. But there are several challenges to develop these…...