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PC Perspective
pcper. com > 2026 > 05 > intel-core-ultra-7-270k-plus-ddr5-frequency-testing

Intel Core Ultra 7 270 K Plus DDR5 Frequency Testing

1+ hour, 23+ min ago  (287+ words) It's no fun talking about memory at the moment, as DDR5 prices are horrifically inflated. The 32 GB Kingston Fury Renegade DDR5-7600 used in The FPS Review's look at the Core Ultra 7" Intel Core Ultra 7 270 K Plus DDR5 Frequency Testing What Is This? A…...

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The Tennessean
tennessean. com > press-release > story > 183452 > sps-international-announces-wafercassettes-com-a-catalog-for-semiconductor-wafer-carriers-and-shipping-solutions

SPS-International Announces Wafercassettes. com, a Catalog for Semiconductor Wafer Carriers and Shipping Solutions

5+ day, 5+ hour ago  (122+ words) A dedicated catalog of PEEK, PFA, polypropylene, and metal wafer cassettes plus shipping containers for fabs, research labs, and packaging facilities. Which cassette material suits high-temperature processing? PEEK and aluminum cassettes are typically selected for processes exceeding 200 degrees Celsius, with…...

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@CGTNOfficial
news. cgtn. com > news > 2026-05-25 > Huawei-unveils-Tau-Scaling-Law-to-hit-1-4nm-equivalent-by-2031-1 Nr3ohj1mqk > p. html

Huawei unveils 'Tau Scaling Law' to hit 1. 4nm equivalent by 2031

9+ hour, 55+ min ago  (29+ words) To address the challenges of the post-Moore era, Huawei unveiled the "Tau Scaling Law" on Monday, setting a target to reach 1. 4-nanometer equivalent chip density by 2031....

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Wccftech
wccftech. com > samsung-leapfrogs-toward-1000-layer-nand-with-first-900-layer-v-nand-prototype

Samsung Leapfrogs Toward 1000-Layer NAND With First 900-Layer V-NAND Prototype, Stacking Two 450-Layer Cells Into One

9+ hour, 6+ min ago  (247+ words) Samsung is getting closer to its 1000-Layer V-NAND tech as it achieves the first 900-Layer prototype, bracing for swift competition with rivals. Samsung is a pioneer in storage semiconductors. Its V-NAND technology is seen as one of the best on…...

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@The Fast Mode
thefastmode. com > technology-solutions > 48626-t-scaling-law-introduced-at-iscas-2026-huawei-proposes-time-based-semiconductor-scaling-beyond-moore-s-law

" Scaling Law Introduced at ISCAS 2026: Huawei Proposes Time-Based Semiconductor Scaling Beyond Moore's Law

13+ hour, 14+ min ago  (172+ words) Southeast Asia Smartphone Shipments Decline ASP Growth Drives Market Shift...

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On MSFT
onmsft. com > news > corsair-ddr5-ram-spotted-with-chinese-cxmt-memory-as-global-dram-shortage-expands

Corsair DDR5 RAM Spotted With Chinese CXMT Memory as Global DRAM Shortage Expands

3+ day, 1+ hour ago  (229+ words) According to images shared by leaker wxnod, Corsair has started using memory chips from Chang Xin Memory Technologies, also known as CXMT, in some of its DDR5 modules. Corsair has traditionally relied on major Korean memory suppliers, so this move stands…...

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Gizmochina
gizmochina. com > 05/25/2026 > huawei-proposes-tau-law-as-alternative-to-moores-law-first-logic-folding-chip-arrives-this-autumn

Huawei proposes "Tau Law" as alternative to Moore's Law, first logic-folding chip arrives this autumn

16+ hour, 18+ min ago  (72+ words) Huawei proposes "Tau Law" as an alternative to Moore's Law, aiming at 1. 4nm-level performance. First Kirin chip launches this autumn....

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Techmeme
techmeme. com > 260524 > p16

At an IEEE conference, Huawei proposed a new chip scaling law and said it aims to design chips with transistor density equivalent to 1. 4nm by 2031

16+ hour, 46+ min ago  (68+ words) Nikkei Asia: At an IEEE conference, Huawei proposed a new chip scaling law and said it aims to design chips with transistor density equivalent to 1. 4nm by 2031 This is a Techmeme archive page. It shows how the site appeared at 11: 50 PM…...

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DIGITIMES
digitimes. com > news > a20/26/0525 PR203 > icatch-technology-asic-2026. html

i Catch Technology Showcases HSB-Aligned Imaging ASIC PAISB at COMPUTEX 2026

19+ hour, 32+ min ago  (426+ words) digitimes i Catch Technology Showcases HSB-Aligned Imaging ASIC PAISB at COMPUTEX 2026 i Catchtek Showcase PAISB at COMPUTEX 2026. Credit: i Catchtek i Catch Technology announced PAISB (Physical AI Sensor Bridge) - a HSB-aligned Imaging ASIC designed to enable scalable, time-aligned multi-sensor ingest…...

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Tech Times
techtimes. com > articles > 317078 > 20/26/0524 > ai-memory-shortage-amds-lisa-su-identifies-high-bandwidth-memory-ai-chip-supplys-next-cap. htm

AI Memory Shortage: AMD's Lisa Su Identifies High-Bandwidth Memory as AI Chip Supply's Next Cap

1+ day, 5+ hour ago  (492+ words) That constraint is now easing. TSMC's Co Wo S output reached approximately 75, 000 wafers per month in 2025, and analysts at Trend Force project further expansion to 120, 000 monthly by the end of 2026 through capacity additions at its AP6, AP7, and AP8 advanced packaging facilities. Nvidia's…...

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